GaN Talk Blog

The full article was originally published in EPDT

The history of power electronics has been a predictable cadence of material limits, architectural shifts, and a new semiconductor platform resetting expectations. Today that transition is happening again, this time with gallium nitride (GaN).

Recent advancements in gallium nitride (GaN) power devices demonstrate a substantial expansion of their operational range into low-voltage applications under 40 V. Silicon MOSFETs have historically dominated this voltage range due to their good conduction performance, well-understood manufacturing processes, and proven reliability.

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In an interview with Judith Cheng, Editor at Large at MakerPROTW, Alex Lidow, co-founder and CEO of Efficient Power Conversion (EPC), described the company’s seventh-generation gallium nitride (GaN) technology, now in mass production, and its implications for low-voltage applications that have traditionally been dominated by silicon MOSFETs. With devices such as the 40 V EPC2366 already in volume production, EPC is positioning GaN as a mainstream option for 40 V and below - a market that exceeds the size of the 100 V segment where GaN first gained traction.

At the Bodo Power Systems Wide Band Gap Forum in Monaco, EPC founder and CEO Alex Lidow set the tone for the GaN discussion, highlighting the significant advantage of gallium nitride (GaN) by drawing on fifty years of experience in power semiconductors. Speaking alongside experts from Texas Instruments, Navitas, Infineon, Toshiba, Volkswagen, and Mitsubishi, he positioned GaN as the superior choice for low-voltage, high-frequency systems—from AI data centers and humanoid robots to autonomous vehicles and LiDAR. While SiC remains the go-to for high voltages, Lidow highlighted GaN as the cost-effective technology already reshaping point-of-load power—and much more.

As artificial intelligence (AI), robotics, and space systems redefine what’s possible in power electronics, gallium nitride (GaN) technology continues to lead the transformation. In a recent interview with Electronic Product Design & Test (EPDT), Dr. Alex Lidow, CEO and co-founder of EPC, shared his perspective on how GaN is reshaping the semiconductor landscape — and what’s next for this fast-evolving technology.

Packaged SEE Immune and Radiation Hardened enhancement mode gallium nitride (eGaN) devices offer dramatically improved performance over the aging Rad Hard silicon MOSFET, enabling a new generation of power converters in space operating at higher frequencies, higher efficiencies, and greater power densities than ever achievable before.