This presentation by Shengke Zhang, VP Reliability at EPC, addresses one of the most common questions in GaN power device reliability: how manufacturers can confidently guarantee a 10-year lifetime without waiting a decade to verify it. The talk introduces the reliability “bathtub curve,” explains the limits of standard 1,000-hour qualification testing, and presents the test-to-fail approach used to predict long-term wear-out behavior. Through a case study on 48 V intermediate bus converter (IBC) modules for data centers, Zhang highlights the impact of temperature cycling, failure-mechanism analysis, and physics-based lifetime modeling to ensure robust GaN performance in demanding high-power-density applications.

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