Long talked about, wide bandgap gallium nitride-on-silicon (GaN-on-Si) transistors are now commercially available. They are being touted for replacing silicon-based MOSFETs, which are turning out to be inefficient for many high-performance power supply designs. Recently, several suppliers of GaN-on-Si-based HEMTs and FETs have emerged in the marketplace, among them Efficient Power Conversion (EPC). To expedite the evaluation of eGAN FETs for power supply designs transitioning from silicon MOSFETs to eGaN FETs, EPC has released several development boards in the last few years.

By Ashok Bindra
Digi-Key Article Library
July 15, 2014
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With high-voltage GaN devices close to commercialization, manufacturers can, at last, look forward massive market growth.

Compound Semiconductor
July, 2014
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This installment will address an eGaN^® FET module designed as a way for power conversion systems designers to easily evaluate the exceptional performance of gallium nitride transistors.

EEWeb
By: Alex Lidow
June, 2014

Overall, 2020 could see an estimated device market size of almost $600M, leading to approximately 580,000 x 6” wafers to be processed. Ramp-up will be quite impressive starting in 2016, at an estimated 80% CAGR through 2020, based upon a scenario where EV/HEV begins adopting GaN in 2018-2019. The power supply/PFC segment will dominate the business from 2015-2018, ultimately representing 50% of device sales. At that point, automotive will then catch-up.

Yole Development
June, 2014
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Gallium Nitride (GaN) based power devices are rapidly being adopted due to their ability to operate at frequencies and switching speeds beyond the capability of Silicon power devices.

Power Electronics Europe
By: Alex Lidow, Ph.D., Johan Strydom, Ph.D., David Reusch, Ph.D.
June, 2014

According to the latest report from Yole Développement, the GaN power industry is set for significant growth in the future.

Compound Semiconductor
June 12, 2014
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High frequency enhancement mode transistors, such as the EPC8000 series eGaN^® FETs from EPC, have been widely available since September 2013 and enable simplified designs at RF frequencies. In this installment, we present the RF characteristics of the EPC8000 series devices and show their implementation in a pulsed class A amplifier. The amplifier is pulsed to allow operation within the thermal operating limits of the device, since RF device power dissipation is typically on the same order of magnitude as the RF power delivered, unlike switching devices, such as the EPC8000 series, that operate well above 95 % efficiency. The EPC8000 series FETs, designed originally for switching power conversion applications, otherwise exhibit excellent RF characteristics and in conclusion will be compared with similar specified LDMOS.

EEWeb
By: Alex Lidow
May 29, 2014

Hundreds of billions of dollars have been spent to make the silicon technology supply chain incredibly efficient. How can emerging, high performance GaN transistors compete against this huge installed base of silicon-based production? Simple, the production of GaN transistors leverages the installed silicon supply chain, which significantly lowers the cost of GaN transistors!

Power Systems Design
By Alex Lidow, Ph.D.
May 27, 2014

Silicon has reached theoretical limits of performance in power conversion. Gallium nitride (GaN) and silicon carbide (SiC) will displace much of the $12B market for silicon power MOSFETs. There is product in production today that is 5-10 times better than the theoretical limit of silicon.

Bodo’s Power Systems
By Alex Lidow, Ph.D.
May, 2014

The popularity of wireless energy transfer has increased over the last few years and in particular for applications targeting portable device charging. In this article, EPC will focus on loosely coupled coils, highly-resonant wireless solutions suitable for the A4WP standard operating at either 6.78 MHz or 13.56 MHz unlicensed Industrial, Scientific and Medical (ISM) bands.

Bodo’s Power Systems
By Alex Lidow, Ph.D. and Michael De Rooij, Ph.D
May, 2014

This column evaluated the ability to parallel eGaN^® FETs for higher output current applications by addressing the challenges facing paralleling high speed, low parasitic devices, and demonstrated an improved paralleling technique. For experimental verification of this design method, four parallel half bridges in an optimized layout were operated as a 48 V to 12 V, 480 W, 300 kHz, 40 A buck converter, and achieved efficiencies above 96.5%, from 35% to 100% load. The design method achieved superior electrical and thermal performance compared to conventional paralleling methods and demonstrated that high speed GaN devices can be effectively paralleled for higher current operation.

EEWeb
By: Alex Lidow
April, 2014

APEC 2014 is over. Held this year in Fort Worth, Texas, the annual IEEE power electronics conference left a number of impressions. For one, gallium-nitride (GaN) power transistors are evolving in interesting ways…

Electronic Design
March, 2014
http://electronicdesign.com/blog/pmbus-gan-and-more-dominate-apec-2014

EPC's Michael de Rooij presenting the Wireless Power Transfer demonstration for Alix Paultre, editor, Power Systems Design magazine.

Power Systems Design
March, 2014
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Since the Robotics and Mechatronics Institute is highly interested in the improvement of sensor and power electronics, we used the opportunity of this new robot development to evaluate the new enhancement mode Gallium Nitride FET technology from EPC and compare it with our up to this time best inverter design.

Bodo’s Power Systems
By Robin Gruber, German Aerospace Center (DLR)
March, 2014

The quality of sound reproduced by an audio amplifier, measured by critical performance parameters such as THD (Total Harmonic Distortion), damping factor (DF), and T-IMD (Inter-modulation Distortion), is influenced by the characteristics of the switching transistors used. Class-D audio amplifiers typically use power MOSFETs, however, lower conduction losses, faster switching speed, and zero reverse recovery losses provided by enhancement-mode GaN (eGaN) FETs enable a significant increase in the sonic quality, and higher efficiency that can eliminate heatsinks. The result is a system with better sound quality in a smaller form factor that can be built at a lower cost.

EEWeb
By: Alex Lidow
February, 2014

Enhancement-mode gallium nitride transistors have been commercially available for over four years and have infiltrated many applications previously monopolized by the aging silicon power MOSFET. There are many benefits derived from the latest generation eGaN® FETs in new emerging applications such as highly resonant wireless power transfer, RF envelope tracking, and class-D audio. This article will examine the rapidly evolving trend of conversion from power MOSFETs to gallium nitride transistors in these new applications.

Power Pulse
By: Alex Lidow
February, 2014

A highly resonant, loosely coupled, 6.78 MHz ISM band wireless power transfer will be presented that show how eGaN FETs are enabling this technology. This column will show efficient wireless energy transfer using current eGaN FETs, and present examples of a voltage mode class D and class E approach.

EEWeb
By: Alex Lidow
January, 2014

Examining new products released by: Texas Instruments, Analog Devices, Linear Technology, Maxim-Integrated, Intersil, Fairchild, EPC, and IR, Don Tuite finds a common thread: the companies’ products are doing the heavy lifting for their customers.

Electronic Design
Don Tuite
January 6, 2014

In this installment a return to hard-switching converters is made, but with a push to higher frequencies – beyond the practical limits of silicon technology.

EEWeb
By: Alex Lidow
December, 2013

Power conversion at switching frequencies of 10 MHz and above requires both high-speed transistors and high frequency capable packaging. eGaN FETs have demonstrated their ability to improve high frequency power conversion compared with the aging power MOSFET by providing unmatched device performance as well as packaging.

Bodo’s Power Systems
Guest Editorial: Alex Lidow
November, 2013